Teledyne Technologies Incorporated Common Stock

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets in the United States, Europe, Asia, and internationally. The Digital Imaging segment provides visible spectrum sensors and digital cameras; and infrared, ultraviolet, visible, and X-ray spectrum products, as well as micro-electromechanical systems and semiconductors, such as analog-to-digital and digital-to-analog converters. This segment offers cooled and uncooled infrared or thermal products, including sensors, camera cores, and camera systems; high-resolution, low-dose X-ray sensors, high-power microwave, and high-energy X-ray subsystems; and instruments for the measurement of physical properties and maritime products, as well as develops and manufactures multi-spectrum electro-optic/infrared imaging systems and associated products, such as lasers, optics, radars, CBRNE (chemical, biological, radiological, nuclear, and explosive) detectors, and unmanned air and ground systems. The Instrumentation segment provides monitoring, control, and electronic test and measurement equipment; and power and communications connectivity devices for distributed instrumentation systems and sensor networks. The Aerospace and Defense Electronics segment offers electronic and optical components and subsystems, data acquisition and communications components and equipment, harsh-environment interconnects, general aviation batteries and other components; and onboard avionics systems and ground-based applications, aircraft data and connectivity solutions, hardware systems, and software applications. The Engineered Systems segment provides systems engineering, integration and advanced technology development, and complex manufacturing solutions for defense, space, environmental, and energy applications; and designs and manufactures electrochemical energy systems and specialty electronics for military applications. The company was founded in 1960 and is headquartered in Thousand Oaks, California.

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